Advanced packaging shortage spans US and EU supply chains

CoWoS-style capacity constraints are driving cross-Atlantic hiring for packaging process and integration engineers.

OSAT expansion in the US and EU is lagging AI accelerator demand. Packaging integration engineers who can work with foundries, substrate vendors and test houses are exceptionally mobile.

Hiring managers are prioritising candidates who understand thermal-mechanical simulation, yield learning and customer-facing technical support.

Visa sponsorship remains common for specialists relocating from Asia. Employers are competing on programme visibility as much as on base compensation.

The next twelve months will favour employers who can show committed capex timelines and defined career paths beyond a single programme.